A chemical vapor deposition process used to deposit a single thin layer (thickness less than 20 micrometer) or multiple thin layers of materials in a gas state (vapor) to a solid state over a substrate. In PECVD, deposition is achieved by introducing reactant gases between parallel electrodes—a grounded electrode and an RF (Radio Frequency)-energized electrode. The capacitive coupling between the electrodes excites the reactant gases into a plasma, which induces a chemical reaction and results in the reaction product being deposited on the substrate. In conservation, PECVD has been used for protection or surface modification of metallic artifacts.
