<?xml version="1.0" encoding="utf-8"?><metadata xmlns:dc="http://purl.org/dc/elements/1.1/"  xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dcterms="http://purl.org/dc/terms/"><dc:title xml:lang="en">plasma-enhanced chemical vapor deposition</dc:title><dc:identifier>http://AATesaurus.cultura.gencat.cat/aat/getty_en?tema=31341696</dc:identifier><dc:language>en</dc:language><dc:publisher xml:lang="en">Getty Institute</dc:publisher><dcterms:created>2026-03-30 20:32:09</dcterms:created><dcterms:isPartOf xsi:type="dcterms:URI">http://AATesaurus.cultura.gencat.cat/aat/getty_en</dcterms:isPartOf><dcterms:isPartOf xml:lang="en">Tesaurus d&apos;Art i Arquitectura</dcterms:isPartOf><dc:format>text/html</dc:format> <dcterms:alternative xml:lang="en">PECVD</dcterms:alternative> <dcterms:alternative xml:lang="en">plasma enhanced chemical vapor deposition</dcterms:alternative> <dc:description xml:lang="en"><![CDATA[ A chemical vapor deposition process used to deposit a single thin layer (thickness less than 20 micrometer) or multiple thin layers of materials in a gas state (vapor) to a solid state over a substrate. In PECVD, deposition is achieved by introducing reactant gases between parallel electrodes—a grounded electrode and an RF (Radio Frequency)-energized electrode. The capacitive coupling between the electrodes excites the reactant gases into a plasma, which induces a chemical reaction and results in the reaction product being deposited on the substrate. In conservation, PECVD has been used for protection or surface modification of metallic artifacts. ]]></dc:description></metadata>