<?xml version="1.0" encoding="utf-8"?><mads xmlns="http://www.loc.gov/mads/" xmlns:mods="http://www.loc.gov/mods/v3" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.loc.gov/mads/
mads.xsd"><authority><topic authority="http://AATesaurus.cultura.gencat.cat/aat/getty_en">plasma-enhanced chemical vapor deposition</topic></authority><related type="broader"><topic>coating</topic></related><variant type="other"><topic>PECVD</topic></variant><variant type="other"><topic>plasma enhanced chemical vapor deposition</topic></variant> <note xml:lang="en"><![CDATA[ A chemical vapor deposition process used to deposit a single thin layer (thickness less than 20 micrometer) or multiple thin layers of materials in a gas state (vapor) to a solid state over a substrate. In PECVD, deposition is achieved by introducing reactant gases between parallel electrodes—a grounded electrode and an RF (Radio Frequency)-energized electrode. The capacitive coupling between the electrodes excites the reactant gases into a plasma, which induces a chemical reaction and results in the reaction product being deposited on the substrate. In conservation, PECVD has been used for protection or surface modification of metallic artifacts. ]]></note></mads>