<?xml version="1.0" encoding="utf-8"?><!DOCTYPE Zthes SYSTEM "http://zthes.z3950.org/xml/zthes-05.dtd">  <Zthes><term><termId>31341696</termId><termName>plasma-enhanced chemical vapor deposition</termName><termType>PT</termType><termNote><![CDATA[ A chemical vapor deposition process used to deposit a single thin layer (thickness less than 20 micrometer) or multiple thin layers of materials in a gas state (vapor) to a solid state over a substrate. In PECVD, deposition is achieved by introducing reactant gases between parallel electrodes—a grounded electrode and an RF (Radio Frequency)-energized electrode. The capacitive coupling between the electrodes excites the reactant gases into a plasma, which induces a chemical reaction and results in the reaction product being deposited on the substrate. In conservation, PECVD has been used for protection or surface modification of metallic artifacts. ]]></termNote><termCreatedDate>2026-03-30 20:32:09</termCreatedDate><relation><relationType>UF</relationType><termId>31341697</termId><termName>PECVD</termName><termType>ND</termType></relation><relation><relationType>UF</relationType><termId>31341698</termId><termName>plasma enhanced chemical vapor deposition</termName><termType>ND</termType></relation><relation><relationType>BT</relationType><termId>31317963</termId><termName>coating</termName><termType>PT</termType></relation></term>  </Zthes>